Product
NEMST-2002IL series
In-line Plasma Cleaner (Strip Type)
In-line Plasma Cleaner (Strip Type)Featuring Design
- In-line Plasma Cleaning Process
- Advanced Flow Pattern Design
- High-Speed Plasma Cleaning: 28~33 seconds/cycle in general, including loading, plasma treatment and unloading
- Low Temperature Plasma Cleaning
- Chamber Capability: 2~3 strips or 5~6 strips of substrates or lead-frames in one cycle. Operation Mode: Manual or Auto Mode
- High Automation and Operation Friendly Design
In-line Plasma Cleaner (Strip Type)Performances
- It can be a standalone machine or connect with upstream and downstream tools
- Multiple Processing Gases (Ar, O2, H2, mixed gas, etc.) can achieve the best surface cleaning and treatment effects
- Physical, Chemical, or Physical/Chemical Mode Cleaning Method
- Extremely High Cleaning Uniformity
- Very Little Gas Consumption
In-line Plasma Cleaner (Strip Type)Applications/Solutions
- Advanced Semiconductor Packaging & Assembly: IC Packaging, LED Packaging, CPO, SMT, Flip-Chip, TCP, COB, substrate cleaning prior to Die Bonding, Wire Bonding, or Encapsulation, and others
- Substrates & Lead Frame Applications: Various substrates including PBGA, Window-BGA, Mini-BGA, Micro-BGA, QFN/MLP, TFBGA, LFBGA, VBGA (EBGA), Pin BGA, PCB, MMC, SD, Micro-SD, and Cu/Ag-Plating/Fe L/F lead frames
- General Electronic Component Cleaning: Plasma cleaning for various electronic or non-electronic components